LED元件簡(jiǎn)介@@@@2008/1/24目錄LED晶片概論LEDLampChipTypeLED(SMDLED)最近的發(fā)展趨勢(shì)LED發(fā)光原理LEDChip(H5C)LEDChipSpecAS/TSAlInGaPChipStructure靜電打穿現(xiàn)象晶片供應(yīng)狀況項(xiàng)目供應(yīng)商型號(hào)紅光-ASOPTO/LumiledsED-H5C紅光-ASOPTO/HitachiCableED-012UOR紅/黃光-TSLumiledsHWFR-B510/B310紅光-TSOPTO/LumiledsED-S5A藍(lán)光UniroyalUNPRC470藍(lán)/綠光CreeC525/470-UB290藍(lán)/綠光CreeC525/470-MB290藍(lán)/綠光CreeC525/470-XB290藍(lán)光OPTO/燦圓ED-014BL藍(lán)光OPTO/連勇ED-014BLLEDLampPackageLEDLampColorLEDLampSpec.ITEMSymbolMaximumRating/RMaximumRating/B&GUnitForwardCurrentIF5030mAPulseForwardCurrentIFP200100mAReverseVoltageVR55VPowerDissipationPD120120mWOperatingTemperatureTopr-30~+85CStorageTemperatureTstg-40~+100CLeadSolderingTemperatureTsol260Cfor5secLEDLampSpec.ItemSymbolConditionRGBUnitForwardVoltageVFIF=20(mA)1.93.53.5VReverseCurrentIRVR=5(V)Max50Max50Max50uALuminousIntensityTIVIF=20(mA)2100620mcdSIVIF=20(mA)1500440mcdRIVIF=20(mA)3801060310mcdQIVIF=20(mA)265mcd銀膠烘烤LEDLampProcess固晶(DieAttach)打線(WireBonding)灌膠(Encap)短烤(PreCure)長(zhǎng)烤(PostCure)銀膠量180C1.5Hr推力測(cè)試320~350C拉力測(cè)試導(dǎo)柱/無導(dǎo)柱模粒使用次數(shù)120~140C1Hr氣密性測(cè)試125C6HrT/G點(diǎn)(130C)VF,IV,WD測(cè)試分Bin支架(LeadFrame)固晶(DiceAttach)模粒(灌膠模)噴離模劑注膠已灌膠之半成品烘烤(50min)(Pre-Cure)半成品電性及外觀檢驗(yàn)第二次切腳分BinLED封裝常見問題偏心(offcenter)晶高不均Open/Short水氣滲入漏電:IR,VF(100uA)PCB污染熱應(yīng)力不良Lamp供應(yīng)狀況(Display)供應(yīng)商波長(zhǎng)角度型號(hào)Nichia626nm-AS70NSPR636AS525nm70NSPG636AS470nm70NSPB636ASNichia626nm120NSPR546BS525nm120NSPG546BS470nm120NSPB546BSCotCo626nm-TS120LO565THR4Agilent626nm-TS120HLMP-SD11三得626nm-AS1204K3RD-S626nm-TS1204K3TRD-S/T供應(yīng)商波長(zhǎng)角度型號(hào)Nichia505nm30NSPE510Swhite20NSPW500BS三得626nm-TS30SDL-5N3TR592nm-TS30SDL-5N3TY605nm30SDL-5N3SOS興華626nm-TS30CSL-U56204W-ETLamp供應(yīng)狀況(交通燈)ChipTypeLEDPCBTypeChipLEDLeadFrameTypeChipLEDChipLED製程銀膠烘烤固晶(DieAttach)打線(WireBonding)Molding測(cè)試切割分Bin銀膠烘烤固晶(DieAttach)打線(WireBonding)灌膠(Encap)短烤(Cure)長(zhǎng)烤(PostCure)測(cè)試分BinPCBTypeLeadFrameTypeChipLED比較項(xiàng)目PCBTypeLeadFrame製程MoldingPottingCostLowHighMaterialMoldingCompoundEpoxy信賴性差佳產(chǎn)品尺寸小(0402/0603)大(0805/1206)LED發(fā)光效率演進(jìn)FirstHighPowerLED

食人魚(Piranha)IntroducedbyHPDrivecurrent:70mA加大散熱機(jī)制主要使用於第三煞車燈HighPowerPackage(LumiLEDs)AdvantageofPowerPackageChipsize12milx12milPowerLEDsreducedLEDcounthigherbrightnessbetterreliabilitylowercostsInputpower:0.5-2WOutputLight:10-100lmChipsize