微專業(yè)---半導(dǎo)體制造技術(shù)課程：半導(dǎo)體工程專業(yè)英語(yǔ)ContentsSemiconductorProperties半導(dǎo)體特性01SemiconductorMaterials半導(dǎo)體材料02SemiconductorDeviceandHowTheyareUsed半導(dǎo)體器件及其使用03ProcessTechnology工藝技術(shù)04FabricationProcesses制造工藝05SemiconductorMaterialsandProcessCharacterization半導(dǎo)體材料與工藝表征06ProcessTechnology4.1SubstratesfromtheProcessPerspective4.2Liquid-Phase(Wet)Processes4.3Gas-Phase(Dry)Processes4.4ProcessesinSemiconductorManufacturing4.5ContaminationControl4.6ProcessIntegration0410Introduction

Inspiteofbeingrelativelyexpensiveanddemandingfromthepointofview

ofrequiredinfrastructureandsafety,processesinvolvingliquidchemicalsand

water(commonlyreferredtoaswetprocesses)cannotbeeliminatedfrom

thesemiconductordeviceprocessingwheretheyareusedforthepurpose

ofcleaningoftheprocessedmaterials,aswellin

materialetchingoperations.Inthecaseofoperationscompatiblewithwetprocesses,themostcommonisimmersionofprocessedmaterialintheliquidagentswithsprayingusedasanalternativesolutioninsomecases.Regardlessofhowanygivenwetprocessisimplemented,however,waterandliquidchemicalsofdesiredcompositionarethekeyelementsinanywet-phaseprocess./??nfr?str?kt??r/基礎(chǔ)設(shè)施4.2Liquid-Phase(Wet)Processes4ProcessTechnology/k?m?p?t?b(?)l/兼容的/?e?d??nts/試劑濕相/?spre???/噴灑/??l?m?ne?t?d/消除11

Waterisamediumofspecialimportancenotonlydirectlyinwetprocessingofsemiconductorwafers,butalsointheotherpartsofsemiconductor

manufacturingendeavor(forinstanceincoolingapplications)whereitisby

farthelargestconsumable.Infact,waterconsumptionperwaferexceeds

byafactorofatleastthreeconsumptionsofenergy,elementalgases,and

specialtychemicalscombined.4ProcessTechnology/k?n?su?m?bl/消耗品4.2.1

WaterText半導(dǎo)體制造4.2Liquid-Phase(Wet)Processes元素氣體/?spe??lti/專門的12

Inthecourseofdevicemanufacturingwaterservesthreemainpurposes.

First,waterisanagentwhichisusedtoestablishdesiredcompositionof

thechemicalsolutionsusedtoprocesswafers.Second,waterisusedtostop

chemicalreactionsbyoverflowingwithwaterreactivechemistriestowhich

semiconductorwafersareexposed.Finally,waterisanagentusedtoremove

productsofchemicalreactionfromthesurfacethroughtheprocessofrinsing.4ProcessTechnology/?r?ns??/沖洗4.2.1

Water/ri??kt?v/反應(yīng)的4.2Liquid-Phase(Wet)Processes/?o?v?r?flo???/溢出的/??kɑ?m?de?t/適應(yīng)/agent/試劑13

Severaltypesofliquidchemicalsbroadlyusedinsemiconductortechnologyincludeacidssuchashydrofluoricacid,HF,sulfuricacid,H2SO4,

andhydrochloricacid,HCl,aswellasalkalisincludingammonia

hydroxide,

NH4OH,potassiumhydroxide,KOH,andsodiumhydroxide,NaOH.The

listofotherreactantsusedinsemiconductorprocessesisrelativelylongand

includes,forinstance,hydrogenperoxide,H2O2,ammonia

fluoride,NH4F,

andsiliconchloride,SiCl4.Inaddition,organicsolventsincludingisopropyl

alcohol,C3H8O,commonlyreferredtoasIPAandmethyl

alcohol(CH3OH,

methanol)areimportantelementsofwetprocessing.Insomespecialized

operationsinvolvedinphotolithography,liquiddevelopers,

adhesionpromoters,andresiststrippersareused.4ProcessTechnology/?d?hi??n/粘附4.2.2

SpecialtychemicalsText4.2Liquid-Phase(Wet)Processes/?str?p?rz/剝離劑/s?l?fj?r?k/硫酸/?ha?dr?flu??ɑ?r?k/氫氟酸的/?ha?dr??kl??r?k氯化氫的/??lk?la?s/堿質(zhì)/p??t?si?m/鉀/??mo?ni?/氨/ha??drɑ?ksa?d/氫氧化物/?so?di?m/鈉/ri??kt?nt/反應(yīng)物/p??rɑ?ksa?d/過(guò)氧化物/?meθ?l??lk?h??l/甲醇/?meθ?n??l/甲醇/?a?s??pro?p?l/異丙基/??mo?ni?/氨/?fl??ra?d/氟化物14

Waferdryingoperationisaninherentpartofanyprocesscarriedoutin

liquid-phaseandendingwithawaterrinse.Waterleftonthesurfaceto

evaporateattractsparticleswhichleavetracesonthesurfaceknownaswater

marks.Thus,theprocessofremovingwaterfromthesurface,ordrying,is

astepwhichdeterminestheconditionofthesurfaceoftherin