標準解讀
《GB/T 44795-2024 系統(tǒng)級封裝（SiP）一體化基板通用要求》是一項國家標準，旨在為系統(tǒng)級封裝技術(shù)中使用的集成化基板提供一套全面的技術(shù)規(guī)范。該標準適用于各種類型的SiP產(chǎn)品設(shè)計與制造過程中的基板選擇、設(shè)計及測試驗證環(huán)節(jié)。它定義了SiP一體化基板的基本性能指標、材料特性、結(jié)構(gòu)設(shè)計原則以及質(zhì)量控制方法等方面的內(nèi)容。
在材料方面，《GB/T 44795-2024》規(guī)定了用于制作SiP基板所需的各種材料應(yīng)滿足的物理化學(xué)性質(zhì)要求，包括但不限于熱膨脹系數(shù)、導(dǎo)電率、介電常數(shù)等關(guān)鍵參數(shù)，并對不同應(yīng)用場景下推薦使用的具體材質(zhì)進行了說明。
對于結(jié)構(gòu)設(shè)計而言，該標準詳細描述了如何根據(jù)實際需求來規(guī)劃合理的布局方案，比如信號傳輸路徑優(yōu)化、電源分配網(wǎng)絡(luò)設(shè)計等，同時給出了關(guān)于層間連接方式的選擇指導(dǎo)，如通孔、盲孔或埋孔的應(yīng)用條件和優(yōu)缺點比較。
此外，《GB/T 44795-2024》還特別強調(diào)了對成品進行嚴格的質(zhì)量檢驗程序，明確了外觀檢查、電氣性能測試、環(huán)境適應(yīng)性試驗等多項評估內(nèi)容及其相應(yīng)的方法步驟。通過這些標準化流程可以有效確保最終產(chǎn)品的可靠性和一致性。
如需獲取更多詳盡信息，請直接參考下方經(jīng)官方授權(quán)發(fā)布的權(quán)威標準文檔。
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- 2024-10-26 頒布
- 2024-10-26 實施
文檔簡介
ICS31.200
CCSL56
中華人民共和國國家標準
GB/T44795—2024
系統(tǒng)級封裝（SiP）
一體化基板通用要求
Generalrequirementsforintegralsubstrate
ofSysteminPackage（SiP）
2024?10?26發(fā)布2024?10?26實施
國家市場監(jiān)督管理總局
國家標準化管理委員會發(fā)布
GB/T44795—2024
目次
前言··························································································································Ⅲ
1范圍·······················································································································1
2規(guī)范性引用文件········································································································1
3術(shù)語和定義··············································································································1
4總體要求·················································································································1
4.1通則·················································································································1
4.2文件優(yōu)先順序·····································································································1
4.3一體化基板類型··································································································2
5特性定義要求···········································································································2
5.1總則·················································································································2
5.2電氣特性···········································································································2
5.3熱特性··············································································································2
5.4結(jié)構(gòu)特性···········································································································2
6設(shè)計要求·················································································································3
6.1總則·················································································································3
6.2一體化厚膜基板設(shè)計要求······················································································3
6.3一體化薄膜基板設(shè)計要求······················································································4
6.4一體化厚薄膜混合基板設(shè)計要求·············································································5
6.5一體化有機印制基板設(shè)計要求················································································6
7驗證要求·················································································································7
7.1總則·················································································································7
7.2驗證方案···········································································································7
7.3仿真模型···········································································································7
7.4試制驗證···········································································································7
7.5建模提參···········································································································7
8制造要求·················································································································8
8.1總則·················································································································8
8.2驗證與制造一致性·······························································································8
8.3關(guān)鍵工序與特殊過程····························································································8
8.4質(zhì)量控制···········································································································8
8.5工藝模型庫········································································································8
8.6環(huán)境要求···········································································································8
9檢驗要求·················································································································8
Ⅰ
GB/T44795—2024
9.1總則·················································································································8
9.2靜態(tài)指標檢驗·····································································································9
9.3環(huán)境性能試驗·····································································································9
10交付要求···············································································································9
10.1標識················································································································9
10.2文件··············································································································10
11產(chǎn)品轉(zhuǎn)運、貯存要求································································································10
11.1轉(zhuǎn)運··············································································································10
11.2貯存··············································································································10
附錄A（資料性）基板設(shè)計典型參考值·············································································11
A.1一體化厚膜基板································································································11
A.2一體化薄膜基板································································································13
A.3一體化厚薄膜混合基板·······················································································15
A.4一體化有機印制基板··························································································15
參考文獻····················································································································17
Ⅱ
GB/T44795—2024
前言
本文件按照GB/T1.1—2020《標準化工作導(dǎo)則第1部分：標準化文件的結(jié)構(gòu)和起草規(guī)則》的規(guī)
定起草。
請注意本文件的某些內(nèi)容可能涉及專利。本文件的發(fā)布機構(gòu)不承擔(dān)識別專利的責(zé)任。
本文件由中華人民共和國工業(yè)和信息化部提出。
本文件由全國集成電路標準化技術(shù)委員會（SAC/TC599）歸口。
本文件起草單位：中國電子科技集團公司第二十九研究所、中國科學(xué)院微電子研究所、清華大學(xué)、
電子科技大學(xué)、廈門云天半導(dǎo)體科技有限公司、成都邁科科技股份有限公司。
本文件主要起草人：李彥睿、王春富、徐洋、邊方勝、賈松良、于慧慧、季興橋、陸吟泉、呂拴軍、
秦躍利、徐榕青、向偉瑋、王文博、張健、徐諾心、萬里兮、于大全、張繼華、李勇、龔小林、高明起、王娜、
張剛、張湉、徐飛。
Ⅲ
GB/T44795—2024
系統(tǒng)級封裝（SiP）
一體化基板通用要求
1范圍
本文件規(guī)定了系統(tǒng)級封裝（SiP）一體化基板通用要求，包括一體化基板總體要求、特性定義、設(shè)計、
驗證、制造、
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